Transactions Indices

• Achanta S. 310
• Addach H. 187
• Aseela Beevi A. 147
• Assoul M. 135
• Atanassoz N. 94
• Ayedi H. F. 187
• Bangert U. 306
• Baranauskas M. 207
• Basak A. K. 310
• Belov I. 40
• Benaben P. 66, 212
• Berçot P. 187
• Bestetti M. 316
• Bozzini B. 123
• Braceras I. 75
• Breakspear S. 237
• Brizuela M. 75
• Campbell S. A. 6, 123, 237
• Carpenter D. E. O. S. 298
• Cavallotti P. L. 27, 316
• Celis J. P. 310
• Chávez E. 46
• Chen H. 270
• Cobley A. J. 293
• Colwell D. 65, 176
• D’Urzo L. 123
• Da Forno A. 316
• De Bonte M. 310
• De Petris-Wery M. 135, 187
• Demčenko I. 87
• Dhanikaivelu N. 274
• Díez J. A. 46
• Dikinis V. 87
• Dong D. 107
• Eagammai C. 166
• Eagleton T. S. 34
• Earwaker L. G. 34
• Farr J. P. G. 6, 34, 175, 176, 298
• Fredenberg M. 40
• Fukumuro N. 111
• Gabe D. R. 72, 179, 285
• Gadzhov I. 141
• Gaignier G. 135
• García-Luis A. 75
• Garmendia I. 75
• Golshan B. M. 99
• Gonzales D. 75
• Grande H. 46
• Griffiths K. 235
• Guixá R. 46
• Halmdienst M. 22
• Hansal W. E. G. 7, 22
• Hemsley D. 113
• Hirano K. 260, 265
• Hope P. 3, 70, 120
• Hryniewicz T. 325
• Hu W. C. 107
• Iglesias-Rubianes L. 306
• Jasulaitienė V. 207
• Jayakrishnan S. 166
• Jiang H. Y. 103
• Jones I. P. 34
• Juodkazis K. 194
• Juodkazytė J. 194
• Kaltenhauser G. 22
• Kautek W. 22
• Koo S.-B. 254
• Larson C. 57, 119
• Lee H.-K. 254
• Leisner P. 40
• Lewis O. L. 283
• Li Y. 237
• Liang C. H. 159
• Liang K. 159
• Liu G. J. 107
• Liu Z. J. 103
• Mackay W. 178
• Magagnin L. 27
• Mangolini F. 27

• Manolova M. 94
• Mantcheva R. 141
• Marti J. 135
• Matsubara Y. 260
• Matsubara Y. 265
• Matsuda H. 111
• Matteazzi P. 310
• Mayanna S. M. 320
• Möller P. 40
• Muralidharan Z. S. 153
• Naruškevičius L. 207
• Niaura G. 87
• Niemczewski B. 202
• Nishiyama J. 111
• Ohishi T. 260, 265
• Ohsaka T. 260, 265
• Onate J. I. 75
• Ongenae R. C. J. 68
• Ouyang Y. 270
• Pakštas V. 207
• Pozzi S. 316
• Rama Prabha R. 274
• Rashkov R. 94
• Rashwan S. M. 217
• Ravindran V. 153
• Read R. R. 118, 284
• Reed A. 58
• Remya R. 147
• Rèzaitè V. 87
• Rezrazi M. 187
• Rokicki R. 325
• Rokosz K. 325
• Rowbotham J. 180
• Rudnik E. 82
• Saremi M. 99
• Šarmaitis R. 87
• Šebeka B. 194
• Sekar R. 166
• Selvi T. C. 166
• Sharma A. K. 320
• Shashikala A. R. 320
• Shibli S. M. A. 147
• Shigeta K. 111
• Šimkūnaitė B. 207
• Skeldon P. 306
• Skrzyniarz P. 82
• Smith J. R. 237
• Speak M. 184
• Stankevičius A. 207
• Suárez C. 46
• Subramanian M. 162, 274
• Sudavičius A. 207
• Suryanto 34
• Takagami H. 111
• Tang P. T. 51
• Thomas P. 212
• Thompson G. E. 306
• Tuaweri T. J. 245
• Vairamuthu R. 162
• Valiulienė G. 207
• Vardavoulias M. 310
• Vermeijlen J. J. T. T. 68
• Vilkauskaitė R. 194
• Viviente J. L. 75
• Vorobyova T.N. 254
• Vrublevskaya O. N. 254
• Walsh F. C. 237
• Wang H. 159
• Wang X. W. 103
• Wang Z. L. 103
• Wery S. 135
• Wilcox G. D. 8, 245
• Wynn P. 177
• Yae S. 111
• Zhan W. L. 107
• Zhang J. 270
• Zhong X. 270
• Zhou X. 306
• Žielienė A. 207
• Zielonka A. 94

• Abrasive wear testing, WC–Co coatings 310
• Acid ZnSO4–CoSO4 bath, Zn–Co plating 298
• Adhesion testing, Ni pulse plating 162
• Aeroengine coatings 231
• Aerospace industry, organic finishing 119
• AGM Christmas Lecture 8
• AGM Minutes 14
• Alcohol additives, Ir plating 260
• Alkaline anodising bath, Mg alloys 316
• Alkaline ZnO–CoSO4 bath, Zn–Co plating 298
• Alloy plating 27, 34, 51, 94, 111, 141, 153, 217, 245, 265, 298, 320
• α-picoline, quinoline additives, Ni pulse plating 162
• Aluminium substrate, Ni pulse plating 162
• Aluminium substrate, silver pulse plating 46
• AM60B magnesium alloys, anodic oxidation, powder coating 316
• Annealing temperature, LNO films 107
• Annual 2007 contents 291
• Anode behaviour, Pd–Ni plating 141
• Anode materials 141
• Anodic alumina film, Al–W alloy, W oxidation state 306
• Anodic linear sweep voltammetry 217
• Anodised-powder coated Mg alloy, roughness 316
• Anodising 212
• Anodising, barrier film, sodium tungstate bath 306
• Argentometric potentiometric titration 254
• Atmospheric plasma spraying WC–Co coatings 310
• Atomic absorption spectroscopy 254
• Atomic force microscopy 46, 103, 107, 187
• Auger electron spectroscopy 207
• Book review 175, 283
• Cathodic polarisation studies, Zn–Ni/SiO2 deposition 245
• Cathodic potentiodynamic studies 27
• Chloride-hypophosphite bath, Ni–Cr–P electroless deposition 320
• Chromium electrodeposition 135, 187
• Chromium electrodeposition, mass balances 135
• Chromium electroplating conditions vs. deposit properties 135
• Chronopotentiometry 194
• Co2S3 thin layer 207
• Cobalt plating, boric acid, manganese 94
• Cobalt, electrodeposition 94
• Cobalt–manganese alloy plating 94
• Cobalt–manganese–phosphorus alloys 111
• Cobalt–nickel pulse plating 274
• Cobalt–phosphorus electroless plating, sulphate–hypophosphite bath 82
• Cobalt–phosphorus, electroless plating 82
• Coefficient of friction, Cr deposit 135
• Compliance models, EU Solvent Directive 180
• Composite electrodeposition 8, 245
• Composite plating 245
• Compositionally modulated multilayers 8
• Conducting polymer coatings, review 237
• Conducting polymers, conduction mechanism 237
• Conducting polymers, synthesis 237
• Conference report – exposure to Ni and compounds, guidance 284
• Conference report – aerospace industry organic finishing 119
• Conference report – greener production, Hong Kong 177
• Conference report – pulse plating 7
• Conference report – resource conservation 176
• Conference report – RoHS compliance 65
• Conference report – SURMAT 06 66
• Conference report – sustainability 176
• Copper additive-free pulse reverse plating 40
• Copper electrodeposition 123
• Copper plating, pulse reverse 68
• Copper recovery 40
• Copper, electroless plating 103
• Corrosion protection, anodised-powder coated Mg alloys 316
• Corrosion resistance 34, 46, 87, 274
• Corrosion resistance, magnetoelectropolished surfaces 325
• Corrosion resistance, Ni–Cr–P electroless coatings 320
• Corrosion resistance, salt spray test 46
• Corrosion resistance, silicate films, zinc 87
• Corrosion testing, anodised-powder coated Mg alloys 316
• Coulometry, electroless Co–P plating 82
• Crack-free Ir–Co electroplates 265
• Cyclic voltammetry 123, 153, 194, 207
• Deburring, descaling, wheel blasting 184
• Deposit alloy ratio Ir/Co dependence, current density, electrode potential 265
• Deposit heat treatment 34
• Deposit morphology, Zn–Cu alloy 217
• Deposit phase analysis, Zn alloy plating 153
• Deposit structure, Zn–Cu alloy 217
• Deposition mechanism, pulse plating, nickel-molybdenum 34
• Deposition-dissolution, Zn alloy plating 153
• Direct Ni plating, Co2S3 thin layer, glassy C, ABS substrates 207
• Dry film lubricant electrocoats 120
• Editorial 6, 57
• Egg ovalbumin absorption, additive, Cu electrodeposition 123
• Electrical sheet resistance 207
• Electrochemical Ag(II) generation, electronics 293
• Electrochemical impedance spectroscopy, Nyquist plots 325
• Electrodeposition 8, 22, 27, 34, 40, 46, 51, 68, 94, 123, 135, 141, 153, 162, 166, 187, 207, 217, 245, 260, 265, 298
• Electroless Au plating 254
• Electroless Co–Mn–P alloy deposition 111
• Electroless Cu plating, deposition rate 103
• Electroless deposition 82, 103, 111, 147, 254, 270, 320
• Electroless Ni bath, sulphate–hypophosphite 147
• Electroless Ni, Ru-based surface activation 147
• Electroless Ni–Cr–P alloy plating 320
• Electroless plating Co alloys 111
• Electroless plating, Co–P, temperature 82
• Electroless plating, Cu, ethanolamine additive 103
• Electroless plating, electronics manufacturing 293
• Electroless plating, Ni, surface activation 147
• Electrolytic colouring, Al anodic films 159
• Electrolytic colouring, Zn sulphate solution 159
• Electron energy loss spectroscopy 306
• Electron probe microanalysis 75, 159
• Electronic energy spectrum analysis (EDAX) 270
• Electrophoretic deposition 3
• Electrophoretic finishing 120
• Electrophoretic nanocomposites 120
• Electrophoretic organo–ceramic hybrids 120
• Electroplating, electronics manufacturing 293
• Energy dispersive spectroscopy 298
• Energy dispersive X-ray spectroscopy 27, 34, 51, 245, 310, 320
• European Solvent Emissions Directive 119, 172, 180
• Ferroelectric thin films 107
• Filtration 3
• Fluorescent X-ray analysis 265
• Friction testing, WC–Co coatings 310
• Galvanostatic polarisation 320
• Gas chromatography thermal conductivity detection 187
• Glow discharge optical emission spectroscopy 111
• Glycine additive, Zn–Cu plating, sulphate 217
• Gold electrodeposits, chemical stripping 166
• Gold electroless plating, mixed reduction/immersion replacement mechanism 254
• Grain growth 34
• Hard Cr electrodeposits, tribological properties 135
• Hard Cr plating 135, 187
• Hard Cr pulse reverse plating, microhardness, occluded H2 content 187
• Hexabromoiridate bath, Ir plating 260
• Hexabromoiridate-sulphate bath, Ir–Co plating 265

• High conductivity pulse plated coatings 46
• High velocity oxy fuel WC–Co coatings 310
• Highly ordered nanoporous alumina 212
• Hommel roughness testing 325
• Hot stage transmission electron microscopy 34
• Hothersall Memorial Award Lecture 2006 75
• Hull cell 285
• Hydrogen evolution, Co–Mn plating 94
• Hydroquinone cavitation activator 202
• Hydroxide content, Co–Mn–P electroless deposits 111
• Hydroxyapatite, nanocoating 99
• Inert Pt, graphite anodes 141
• Infrared absorption spectroscopy, Fourier transform 87
• Ionic liquid deposition 8
• Iridium plating 260
• Iridium–cobalt alloy plating 265
• Iron–zinc alloy deposit structure 270
• Iron–zinc electroless plating 270
• Lanthanum nickel oxide thin film deposits, morphology 107
• Laser surface profilometry 75
• Leakage current, thin films 107
• Letters 58, 113
• Life cycle analysis 68
• Linear potentiodynamic sweep technique, electrodeposition kinetics, Zn–Co 298
• Linear sweep voltammetry 260
• Low concentration sulphamate baths, Co plating 94
• Low temperature curing electrocoats 120
• Magnetic coercivity, electroless Co–Mn–P(OH) 111
• Magnetoelectropolishing 325
• Manganese–copper pulse plating 27
• Manganese–copper pulse plating, sulphate bath 27
• Metal stripping 72
• Metal stripping, principles 72
• Metal stripping, solution design, effluent disposal 72
• Metal whiskers, tin, zinc 8
• Microelectronics pulse reverse plating 40
• Microhardness 27, 34, 51, 147, 187, 274, 320
• Morphology 27, 46, 82, 94, 99, 107, 123, 147, 187, 217, 245, 254, 270, 298, 320
• Morphology, Cu electrodeposits, egg ovalbumin absorption 123
• MoSx lubricant coatings 75
• Multilayer electrocoats 120
• Nadcap compliance audits 119
• Nanoparticles, Zn–Ni/SiO2 plating 245
• Nanostructure 34, 99, 310
• Nanostructured WC–Co coatings, tribology 310
• Nickel plating 22
• Nickel plating, Watts bath 207
• Nickel pulse plating 162
• Nickel pulse plating, electrochemical parameters, bath composition 22
• Nickel pulse plating, mechanism 22
• Nickel pulse plating, sulphamate bath 22
• Nickel–cobalt, cobalt–nickel–iron alloys, pulse reverse plating 51
• Nickel-molybdenum pulse plating, sulphamate bath 34
• Ni–Cr–P alloy coating, electroless deposition 320
• O. P. Watts, biography 179
• Obituary – E. Survila 178
• Organic finishing 119
• Oxalic acid anodising, high ordering 212
• Painting, silicones, cratering 70
• Palladium-nickel alloy plating 141
• Particle filtration 3
• Photocatalysis surface modification, electronics 293
• Photocolorimetry 254
• Physical characteristics, Ru-activated electroless Ni 147
• Plasma surface modification, electronics 293
• Platinum substrate, Cu electrodeposition 123
• Polarisation curves, Pd–Ni electrolyte, anode behaviour 141
• Polarisation curves, Ru-activated electroless Ni 147
• Polarisation resistance 274
• Polyamide composites 235
• Polyamide paint additives 235
• Polyamide powder coatings 235
• Polyamides, aerospace industry 235
• Polymer surface modification processes, review 293
• Potentiodynamic polarisation curves 325
• Pulse duty cycle, Co–Ni pulse plating 274
• Pulse plating 22, 27, 34, 40, 46, 51, 99, 162, 274
• Pulse plating, nano-hydroxyapatite, Ti alloy base 99
• Pulse plating, nickel 162
• Pulse plating, pcb process optimisation 40
• Pulse reverse Cr plating, optimisation, statistical design 187
• Pulse reverse plating 40, 51, 68, 187
• Pulse reverse plating, copper, electronic applications 40
• Pulse reverse plating, copper, Kyoto issues 68
• Pulse reverse plating, nickel alloys 51
• R. O. Hull biography 285
• Residual stress, pulse reverse plating 51
• Resistivity, electroless Co–Mn–P(OH) 111
• Resistivity, sheet resistance, ferroelectric thin films 107
• Review paper 237, 293
• Rotating disc electrode, Zn–Co deposition 298
• Roughness, laser profilometer 316
• Ruthenium oxide anode 141
• Ruthenium, RuO2 electrodes 194
• Ruthenium-based surface activation 147
• Rutherford backscattering 34
• Scanning electron microscopy 27, 34, 75, 82, 94, 99, 123, 147, 212, 217, 245, 270, 274, 298, 310, 316, 320
• Scanning transmission electron microscopy 306
• Scratch testing, Cr deposit 135
• SEM-field emission gun 212, 245
• Silicate conversion films 87
• Silicate passivation films, formation mechanism 87
• Silver nanocoatings 46
• Silver pulse plating, cyanide bath 46
• Sliding wear testing, WC–Co coatings 310
• Sodium metasilicate solution, passivation 87
• Soft magnetic alloy pulse reverse plating 51
• Sol gel spin coating, LNO thin films 107
• Soluble Pd, Ni anodes 141
• Sonochemical surface modification, electronics 293
• Sputtering physical vapour deposition 75
• Sulphamate bath, Zn–Ni plating 153
• Sulphate bath, Ni–Co pulse plating 274
• Sulphate bath, Zn–Co plating 153
• Sulphate bath, Zn–Fe plating 153
• Sulphate composite plating bath, Zn–Ni/SiO2 245
• Sulphate-hypophosphite bath, Fe–Zn electroless plating 270
• Superfilling 103
• Surface electrochemistry, Ru, RuO2 electrodes 194
• Surface enhanced Raman spectroscopy 123
• Surface modification, polymers, electronics manufacturing, review 293
• Surface roughness 103, 123, 274, 316, 325
• Tetrachloroaurate–hexacyanoferrate electroless Au bath 254
• Throwing power 46, 162
• Throwing power, Ni pulse plating 162
• Transient electrokinetic studies 27
• Transmission electron microscopy 34, 99, 254, 306, 310
• Tribological properties 34, 135
• Tribology, lubricant coatings 75
• Two-step anodising, highly ordered anodic growth 212
• Ultrasonic cleaning, alkaline solutions 202
• Ultrasonic cleaning, cavitation intensity 202
• UV/ozone surface modification, electronics 293
• Watts Ni bath, pulse plating 162
• Wear testing 75
• X-ray diffraction 27, 46, 99, 103, 107, 153, 159, 207, 217, 254, 270, 274, 310, 316, 320
• X-ray fluorescence spectroscopy 274
• X-ray photoelectron spectroscopy 75, 207, 316
• Zinc substrate, silicate films 87
• Zinc–cobalt alloy plating, kinetics 298
• Zinc–copper alloy plating, sulphate bath 217
• Zinc–nickel/silica composite plating 245
• Zinc-transition metal alloy plating 153

• Akid R. 188
• Ana U. 141
• Armstrong G. 277
• Bavykin D. V. 293
• Berkani A. 125
• Boiadjieva T. 313
• Bozzini B. 83,154,177
• Camargo P. 320
• Češuniene A. 241
• Chan K. C. 252
• Chapaneri R. 229
• Cobley A. J. 149
• Colwell D. 2,172
• Cree A. M. 246
• Cressey B. A. 293
• Critchlow G. W. 115
• D’Urzo L. 83,177
• Dahm R. H. 188
• Davenport A. 174
• De Gaudenzi G. P. 154
• Dobreva Ek. 99
• Elliot D. 231
• Gabe D. R. 67,149
• Gao C. Z. 256
• Gao Y. 141
• Giovannelli G. 177
• Gough J. 125
• Greenfield D. 188
• Gu M. 196
• Habazaki H. 125
• Hagiwara H. 260
• Hainsworth S. V. 246
• Handy S. L. 300
• Hemsley J. D. C. 28
• Honma H. 260
• Hu F. 252
• Huang L. 47
• Jasulaitienė V. 162
• Jayachandran M. 52
• Jayakrishnan S. 52,202
• Johnson J. C. 8
• Kanapeckaitė S. 94
• Kimizuka R. 260
• Koo S. B. 206,211
• Kuznetzov B. V. 159
• Lansdell P. 6
• Lapkin A. A. 293
• Larson C. 233
• Lee H. K. 206,211
• Lemasters O. R. 63
• Lewis O. D. 118,188
• Lisowska-Oleksiak A. 241
• Liu R. T. 256
• Lyon S. B. 23
• Matykina E. 125
• Mele C. 83,154,177

• Mockus Z. 94
• Monev M. 313
• Monfort F. 125
• Montuori M. 125
• Mukherjee P. 134
• Murciano L. T. 293
• Narayanan R. 134
• Niemczewski B. 218,266
• Noncheva Z. 99
• Norton B. 277
• Oduoza C. F. 300
• Ohba M. 320
• Pan R.D. 256
• Panossian Z. 320
• Pearson T. 60,121,300
• Petrov K. 313
• Petrova M. 99
• Philippe L. 23
• Prizker M. D. 36
• Pushpavanam M. 79,326
• Raichevski G. 313
• Rao C. R. K. 79
• Ravindran V. 202
• Read R. R. 57
• Romanello V. 83,154,177
• Samulevičienė M. 94
• Selskis A. 105,241
• Seshadri S. K. 134
• Sigamani S. 326
• Skeldon P. 125
• Subramanian B. 52
• Survila A. 94
• Surviliene S. 241
• Szczygiel B. 309
• Tantavichet N. 36
• Tarozaitė R. 105
• Thompson G. E. 125
• Timms J. 274
• Tselesh A. S. 206,211
• Tsuousoglou E. 23
• Turkiewicz-Głęboki A. 309
• Valiulienė G. 162
• Vorbyova B. V. 159
• Vorobyova T. N. 206,211
• Walsh F. C. 293
• Weidmann G. W. 246
• Wilcox G. D. 141,188
• Wynn P. 117,280
• Wyszynski E. 226
• Xu S.-K. 47
• Yang F.-Z. 47
• Yao S.-B. 196
• Zheng Y. 256
• Zhou S.-M. 47,196
• Žielenė A. 162

• Acid copper plating solution 36,47,83,94,149,177
• Acid copper plating 260
• Acid copper plating, brightener consumption 149
• Acrylic/urethane finishes 277
• Adsorption layers 94
• Aerospace coatings 277
• Air sparging agitation 67
• Alkaline non-cyanide zinc plating 326
• All powder topcoat systems 8
• Alternative pretreatments to Cr(VI), environmental impact 229
• Aluminium alloys, ease of electrodeposition onto 121
• Aluminium pre-treatment, electrodeposition 121
• Aminoacetic acid complexant 309
• Anodic polarisation studies 141,149
• Anodised thin films 246
• Anodising, spark, titanium 125
• Anodising, Ti-Al-V alloy, corrosion properties 134
• Anti-corrosion coatings, environmental pressure 280
• Anti-corrosion coatings, operational audits 280
• Antique battery powered organs 28
• Atomic absorption spectrophotometry 326
• Atomic force microscopy 52,105
• Attenuated total reflection IR spectroscopy 23
• Attrition coatings 277
• Auger electron spectroscopy 159
• Automotive industry, environment/health 118
• Batteries 28
• Bioactive coatings, spark anodised titanium 125
• Biomedical applications, spark anodised titanium 125
• Bis-(3-sulphopropyl)-disulphide additive, copper deposition 83
• Book reviews 60,115,174
• Bright Ni plating 256
• Catalytic anodes, acid copper plating, brightener consumption 149
• Cathode efficiency platinum plating 79
• Cavitation intensity water/ aqueous solutions 266
• Cavitation intensity 266
• Ceramic nano-particle composite coatings 277
• CETS meeting report 6,231
• Chromates, molybdates, tungstates, cerium trichloride inhibitors 141
• C(III) plating bath 241
• Chromium electrodeposition 241
• Chronoamperometry 196
• Co/Cu multilayers 196
• Cobalt electrocrystallisation 196
• Complexing agent electroless bath 309
• Conformal plating 260
• Contact mode atomic force microscopy 241
• Conversion coatings 141
• Copper deposit morphology, thiourea 36
• Copper electrochemical nucleation/growth 47
• Copper electrodeposit 36
• Copper electrodeposition 36,47,83,149,177,260
• Copper recovery 202
• Copper surface activation 99
• Copper-nickel sequential deposition 52
• Copper-tin electrodeposition 159
• Copper-tin electrodeposits, amorphous phase 159
• Corrosion behaviour, Cr(III) deposit 241
• Corrosion protective tin deposits 211
• Corrosion rate study 300
• Cr(III) anti-corrosion coatings 280
• Cr(III) formate-urea electrolyte 241
• Cr(VI)-free anti-corrosion coatings 280
• Cu deposit mechanical properties 260
• Cu plating via filling performance evaluation 260
• Cu(II) additive, electroless Ni 105
• Current distribution, fluidised bed, modelling 154
• Current-potential studies 260
• CVD coatings, environmental impact 229
• Cyclic voltammetry 162,196,202
• Cyclic voltammetry, copper deposition 83
• Decorative Cr electrodeposition 300
• Dense phase powder pump 8
• Dicarboxylic acid additives, electroless Ni 105
• Dry film lubricants 277
• Eductor agitation 67
• Electrochemical impedance spectroscopy 94,241,252
• Electrocrystallisation 47,196
• Electrodeposited zinc coatings 188
• Electrodeposition process agitation 67
• Electrodeposition 36, 79, 83, 121, 159, 177, 188, 241, 252, 256, 260, 300, 313,320,326
• Electrodeposition, copper-tin 159
• Electroless composite nickel-TiO2 deposits 99
• Electroless deposition 99,105,309
• Electroless nickel deposition 105
• Electron beam evaporation 52
• Electroreflectance spectroscopy, in situ 177
• Energy dispersion spectroscopy 313
• Energy dispersion X-ray diffraction analysis 159
• Environmental impact of coatings 229
• Environmental/health issues 118
• Epoxy/phenolic coatings 277
• Evaporated sequential Cu-Ni characterisation 52
• FEG scanning electron microscopy 188
• Fluidised bed reactor, controlled anodic dissolution, metal powder 154
• Fluorosilicate electrolyte, Cu-Sn plating 159
• Fourier transform IR spectroscopy 134
• Gold ion reduction 293
• Green finishing technology Hong Kong 274
• Hard Cr plating, environmental impact 229
• Heavy metal recovery 202
• Hexavalent chromium 6
• Highly oriented pyrolytic graphite 47
• Hull cell testing 326

• HVOF sprayed WC-Co-Cr, environmental impact 229
• Hydrodynamic movement intensity 218
• Hydroxyapatite 125
• IMF Hong Kong branch, inaugural meeting 117
• Implementing environmental legislation 177
• Ion selective electrodes 23
• Ionic diffusion direct measurement 23
• Ionic diffusion epoxy coatings 23
• Jet flow agitation 67
• Levellers, copper plating 177
• Linear polarisation measurements 300
• Mechanical agitation 67
• Metal powder corrosion, fluidised bed 154
• Microhardness 252
• Microhardness, nickel composites 99
• Micrometric/submicrometric metal powder, controlled anodic dissolution 154
• Molybdate passivation morphology 188
• Molybdate passivation treatments 188
• Morphology, tin deposits 206,211
• Nickel electrodeposition 256
• Nickel plating, environmental impact 229
• Nickel recovery 202
• Nickel sulphide reduction 162
• Nickel toxicity risk assessment 6
• Nickel/chromium deposits 300
• Nickel-SiC composite plating 252
• Ni-W-P electroless deposition 309
• Nucleation mechanism, Co/Cu multilayers 196
• Organic coatings 118
• Organic coatings, environment/health, automotive industry 118
• Organic reductants, L-ascorbic acid, brightener consumption, acid copper plating 149
• Paint overspray recycling 63
• Palladium ion reduction 293
• Passivation treatments 141
• PHOS mist suppressant 6
• Piperonal brightener additive 326
• Plating effluent electrochemical behaviour 202
• Plating effluent treatment 202
• Platinum deposit structure 79
• Platinum electrodeposition 79
• Platinum ion reduction 293
• Platinum-ammine complex bath 79
• Polarisation curves 320
• Polyethylene glycol, copper deposition 47
• Potentiodynamic polarisation scans 313
• Powder coatings 8
• Powder topcoat green benefits 8
• Precious metal chemical deposition 293
• Precious metal electrochemical reduction 293
• Precious metal ion exchange 293
• Precious metal nanoparticles 293
• Precious metal photochemical reduction 293
• Protective organic coatings 23
• Protein films, corrosion inhibitor doped 141
• Protein films, zinc plated steel surface protection 141
• Protonated titanate nanotubes 293
• Pulse frequency, Ni-SiC plating 252
• Pulse plating 252
• Pyridinium-1-propane-3-sulphonate/saccharine analysis 256
• REACH legislation 6
• Residual stresses, anodised thin films 246
• Rotating disk electrode studies 206,211
• Ruthenium ion reduction 293
• Salt spray corrosion tests 141,188
• Scanning electron microscopy 99,141,159,252,260, 293,300,326
• Self vibrating electrode technique 188
• SILAR method, NiS reduction, Watts Ni electrolyte 162
• Simulated body solution, corrosion, anodised Ti alloy 134
• Sintanol DS10 polyether additive, Cu plating 94
• Sodium chloride salt spray tests 300
• Solution agitation theory 67
• Solution agitation 67
• Spark anodising, titanium, composition, structure, morphology 125
• Stannous chloride/citrate immersion bath 206,211
• Strain-energy method, residual stress 246
• Surface enhanced Raman spectroscopy 83,177
• Surface finishing sector statistics 233
• Surface roughness, electroless Ni 105
• Thermal spray equipment, environmental impact 229
• Thermal spray gases, environmental impact 229
• Thiourea additive, acid copper bath 36
• Throwing power 260
• Tin immersion deposits 206,211
• Tin immersion plating on zinc 206,211
• Titanium, spark anodising, biomedical applications 125
• Transmission electron microscopy 134,159,206,211,293
• Trivalent Cr electrodeposition 300
• UK surface finishing sector challenges 233
• Ultrasonic cleaning 218,266
• Ultrasound in water solutions 218
• Ultraviolet absorption spectrophotometry 256
• Via filling 260
• Voltammetry, Cu reduction 94
• XPS analysis Cu deposit 36
• X-ray diffraction 134,260,313
• X-ray fluorescence spectroscopy 79,326
• X-ray fluorescence 52
• X-ray photoelectron spectroscopy 36,162,313
• Zinc carbon bichromate batteries 28
• Zinc electrodeposition 320
• Zinc recovery 202
• Zn-Co alloy electrodeposition 326
• Zn-Cr alloy deposit corrosion behaviour 313
• Zn-Cr alloy electrodeposition 313
• Zn-Cr sulphate electrolyte 313

• Abbott A. P. 51
• Ananth M. V. 137
• Beech I. B. 19
• Bikulčius G. 154
• Boshkov N. 188
• Breakspear S. 63
• Camargo P. 199
• Campbell S. A. 1,19,63,217
• Cao C. 95
• Capper G. 51
• Češuniene A. 130
• Davies W. 19
• Dennis J. K. 119
• Ding W. 91,286
• Dobrev Ts. 291,296
• Farr J. P. G. 1,27,217
• Fisher B. 226
• Fletcher R. J. R. 63
• Fukumuro N. 281
• Gabe D. R. 121,164
• Gaponenko N. V. 233
• Ghyoot W. 226
• Gillard S. P. 19
• Gladstein M. 148
• Golozar M. A. 99
• Gómez E. 248
• Green R. 226
• Guterman H. 148
• Hashimoto T. 125
• Hemsley D. 59
• Hu W. 91,286
• Huang H. F. 82
• Ikigai H. 205
• Jagminienė A. 68
• Jasulaitiene V. 130
• Jayakrishnan S. 104,300
• Juskenas R. 210
• Kalpana D. 137
• Kanematsu H. 205
• Kikuchi Y. 205
• Klimantaviciute M. G. 210
• Koleva D. 188
• Kolodziej M. 181
• Krishnan R. M. 104
• Landell P. 166,167
• Lawton P. 19
• Lewerenz H. J. 238
• Lewis O. 268
• Lin Y. T. 82
• Lisowska-Oleksiak A. 130
• Liu X. 286
• Liu Y. 125
• Lorenz W. 269
• Lublow M. 238
• Malyarevich G. K. 233
• Mantcheva R. 141
• Marikkannu C. 158
• Martušienė A. 154
• Martyak N. M. 43
• Matsuda H. 281
• Mohan S. 72,194

• Molchan I. S. 233
• Monger G. 19
• Muralidharan V. S. 104,300
• Newby K. R. 272
• Niemczewski B. 109
• Nishiyama J. 281
• Ohba M. 199
• Oki T. 205
• Pakstas V. 210
• Panossian Z. 199
• Pearson T. 2,171
• Pellicer E. 248
• Pigaga A. 210
• Pushpavanam M. 77
• Pushpavanam S. 77
• Qiao Y. 95
• Raeissi K. 99
• Raichevski G. 188
• Raj V. 72,194
• Read R. R. 13,166
• Ručinskienė A. 154
• Saatchi A. 99
• Samulevičienė M. 154
• Sathiyanarayanan S. 158
• Schofield E. 35
• Seefeldt R. 43
• Sekar R. 104,300
• Sheela G. 77
• Shulker I. 272
• Skeldon P. 125,233
• Smith C. J. E. 125
• Smith J. R. 63
• Stefanov Y. 291,296
• Stupak A. P. 233
• Surviliene S. 130
• Swain B. G. 51
• Szczygiel B. 181
• Szpunar J. A. 99
• Thompson G. E. 125,233
• Tsyrkunov D. A. 233
• Valiulienė G. 68
• Vallés E. 248
• Veleva L. 188
• Venkatachari G. 158
• Virbalyte D. 210
• Wang F. 258
• Watanabe T. 258
• Wei Z. 255
• Wheeler D. A. 51
• Wilke E. 269
• Wu Y. 91
• Xiang Y. 91,286
• Yae S. 281
• Yan L. 95,255
• Yin K.-M. 82
• Zhang J. 95
• Zhang J. 255
• Zhao C. 91
• Zhou G.-D. 95
• Zhu L. 258
• Žielienė A. 68

• Acid tin methanesulphonate electrolytes 43
• Alternating voltage passivation 95
• Alumina 233
• Aluminium alloys 35,125,154
• Aluminium anodised templates 35
• Anodes 291,296
• Anodic selective dissolution 35
• Anodising 35,233
• Atomic force microscopy 43,63,125,154,238
• Atomic force-distance curves 63
• Auger spectroscopy 286
• Automobile sheeting 269
• Biocides 19
• Book review 119,268
• Brewster angle ellipsometry 238
• Capacitance 255
• Cement kiln dust 210
• Ceramal anodes 141
• Chemical substitution issues 2
• Chloride ions 43
• Chromate coatings growth 125
• Chromispel-C electrolytes 141
• Chromium (III) 272
• Chromium (VI) 130,272
• Chromium coatings 130
• Chromium electrodeposition 141
• Chromium(III) colour 27
• Co(II)-ammonia complexes 68
• Coating adhesion 286
• Cobalt alloy coatings 248
• Cobalt chloride 198
• Cobalt complex composition 68
• Cobalt electrodeposition 198
• Cobalt sulphate 281
• Cobalt sulphide coatings 68
• Cobalt-molybdenum coatings 248
• Cobalt-nickel coatings 248
• Cobalt-nickel-molybdenum coatings 248
• Cobalt-phosphorus films 281
• Colour measurement 27
• Colour 27
• Complexant shape 300
• Complexant stability 300
• Composite coatings 130,181,188
• Composites 291,296
• Conversion coatings 125,154,258
• Copper electrodeposition 171,194
• Copper 125
• Corrosion resistance 72,99,130,154,181,188,205
• Cr(VI)-free colouring of stainless steel 95
• Crystalline-amorphous transition 281
• Current density control 148
• Cyanide replacement 300
• Cyclic voltammetry 291,296,300
• Differential scanning calorimetry 91
• Economic challenges 2
• Editorial 1,217
• Effluent treatment 210
• Electrocatalysis 137
• Electrochemical conservation method 19
• Electrochemical impedance spectroscopy 72,130,154,181
• Electrochemical stability 141
• Electrodeposit texture 99
• Electrodeposition 72,77,82,99,130,
  137,141,148,171,
  181,189,194,249,291,296,300
• Electroforming 268
• Electroless cobalt-phosphorus deposition 281
• Electroless deposition 281,286
• Electroless nickel deposition 91,286
• Electron microscopy 72,77,99,104,188,205,252,
  258,281,286,291,296
• Electroplating 226,272
• Electropolishing 51
• Electrowinning 291,296
• Energy dispersive X-ray spectroscopy 205,281
• Environmental emissions 226

• Environmental impact 165,167,272
• Ethylene glycol-choline chloride 51
• European electroplating industry 2
• European environmental regulations 2
• Faradaic current profiles 171
• Fluoride film 286
• Fracture 286
• Functional chromium deposits 272
• Galvanised steel 205
• Gold electrodeposition 72,148
• Gold electrodeposits 72
• Grain size 72
• Hardness 104
• Heavy metal ion removal 210
• Hot sulphuric acid passivation 95
• Hydrogen evolution 137
• Impedance measurements 255
• Ion chromatography 43
• Jewellery 268
• Lead alloys 291,296
• Lead composite anodes 291,296
• Lead-cobalt coatings 291,296
• Light absorption spectra 68
• Magnesium alloys 91,286
• Magnetic properties 82
• Mathematical modelling 82
• Microbially influenced corrosion 205
• Micro-electromechanical systems 248
• Microstructure 281
• Morphology 43,188,286
• Nanoporosity 35
• Nanoporous structures 35
• Nickel alloy coatings 137
• Nickel plating 226
• Nickel sulphate-thiocyanate 137
• Nickel-alumina coatings 181
• Nickel-iron coatings 82
• Nickel-manganese-sulphur coatings 137
• Nitric acid passivation 158
• Occupational exposure 226
• Optoelectronics 233
• Organic polymer particles 188
• Parallel plate flow electrodeposition 82
• Passivation treatment additives 158
• Passivation 158,255
• Phosphating 154
• Phosphorus content 91
• Photoluminescence 233
• Plating additives 194
• Platinum bromide electrolyte 77
• Platinum electrodeposition 77
• Platinum-iridium coatings 77
• Polarisation curves 198
• Porosity 72,130
• Porous anodic alumina 233
• Pulse plating 72,148,194
• Pulse reverse electrodeposition 171
• Silicon carbide particles 130
• Silicon substrate 238
• Sports equipment materials 119
• Stainless steel 51,95,158,255,258
• Static magnetic fields 154
• Structurally graded films 281
• Surface roughness 238
• Tafel equation 121
• Technology challenges and opportunities 164,167
• Thickness 43
• Thiobacillus Ferrooxidans 205
• Tin deposit composition 43
• Tin electrodeposits 43
• Ultrasonic cavitation 109
• Ultrasonic cleaning 109
• Weldable primer coatings 269
• X-ray diffraction 77,91,99,104
• Zinc acetate electrolyte 104,300
• Zinc coatings 99,105,188,205,300
• Zinc electrodeposition 99,105,300
• Zinc electrowinning 291,296
• Zinc phosphate coatings 258
• Zinc-cobalt coatings 188

• Abbass M. A. 87
• Abbott A. P. 14
• Aikaité J. 33
• Akid R. 18
• Amin M. A. 87
• Archer E. 29
• Archer J. 14
• Azim S. Syed 24
• Bahrololoom M. E. 51
• Bains N. B13
• Barshilia H. C. 123
• Baskevich A. S. 144,147
• Bernataviius T. 98
• Bortels L. 133
• Bozzini B. 118
• Brumpton G. 18
• Burokas V. 137
• Capper G. 14
• Cešunien A. 185
• Crichton T. J. 169
• Cui J. Z. 129
• D. B. Lewis D. B. 64
• Davies, D. L. 14
• Deconinck J. 133
• Demenko I. 98
• Dikinis V. 98
• Dolgov I. A. 33
• D’Urzo L. 118
• Edyvean R. 29
• Farr J. P. G 105,169,B30
• Fisher B. B21
• Fukumuro N. 114
• Gabe D. R. 8,51,181,B42
• Ganitch R. Ph. 144,147
• Giebler E. 75
• Giovannelli G. 118
• Girchieneq O. 137
• Goosey M. B13
• Gulivets A. N. 144,147
• Gyliené O. 33,38
• Ibrahim M. A. M. 87
• Ivaškevich E. 93
• Jayakrishnan S. 164
• John C. 14
• Juškeqnas R. 185
• Kalinichenko A. 93
• Kerr C. B7
• Kostov Z. 157
• Krishnan R. M. 164

• Kumar K. 24
• Lansdell P. A. W. 105
• Lehmberg C. E. 64
• Lei W. N. 141
• Mantcheva R. 59,83
• Marshall G. W. 64
• Martušieneq A. H. 137
• Martyak N. M. 150
• Matsuda H. 114
• Mele C. 118
• Mitsumata N. 114
• Muralidharan V. S. 164
• Nelissen G. 133
• Niemczewski B. 71
• Nivinskiné O. 38
• Okamoto N. 114
• Petrova M. 43
• Poojari A. 123
• Prakash M. S. 123
• Purcar M. 133
• Pushpavanam M. 24,174
• Qu N. S. 141
• Rajam K. S. 123
• Ramanauskas R. 93,137
• Ramkishan Rao Ch. 24
• Rasjeed K. 14
• Reqzaiteq V. 98
• Šarmaitis R. 98
• Seefeldt R. 150
• Sekar R. 164
• Selskis A. 93,98
• Sheela G. 24
• Shtapenko E. Ph. 144,147
• Siluvai M. M. 174
• Stoyanova E. 157
• Stoychev D. 157
• Survilieneq S. 185
• Takeva St. 157
• Tarozaité R. 33,38
• Van den Bossche B. 133
• Ward D. B. 29
• Wilcox G. D. 51
• Wright N. B13
• Xu G. M. 129
• Xu H. 18
• Yae S. 114
• Yamagishi K. 114
• Zabludovsky V. A. 144,147
• Zhu D. 141

Subject Index 2004, Volume 82

• ABS 43
• Acetate baths 87
• Acid sulphates 118
• Activation 87,114,118
• Additives 118
• Adipate 38
• Adsorbates 114
• Adsorption 29,38
• Agitation 181
• Alkaline solutions 137
• Aluminium 24,129,157
• Amorphous carbon 123
• Amorphous layers 123,137,144,147
• Anodising 157,181
• Atomic force microscopy 18,137
• Azodyes 157
• Biosorption 29
• Black chromium 14
• Bright tinplate 169
• Brightness 83
• CAD 133
• Cadmium 29
• Carbide particles 185
• Carbon 123
• Carboxylic acids 98
• Carcinogens 105
• Cascade rinsing 75
• Catalysis 114
• Cathode supersaturation 144
• Cathodic processes 59
• Cavitation 71
• Chitosan 38
• Chloride 150
• Choline 14
• Chromating 98,181
• Chromium (III) 18,105
• Chromium (VI) 18
• Chromium black 14
• Chromium nitrate 98
• Chromium plating 59,83,133,185
• Cladding 129
• Cleaning 71
• Cobalt 174
• Colour anodising 157
• Composite coatings 43,185
• Composites 129
• Compositionally modulated coatings 51
• Conversion films 98
• Copper 29,114
• Corrosion resistance 51,123,137,141,
• 157,174
• Corrosion 18,93,98,185
• Crabshell 29
• Crystallisation 147
• Crystallography 64
• Cyanide replacement 164
• Decontamination 33
• Deposit thickness 133
• Diffusion dialysis B7
• Diffusion reaction 169
• Dispersed particles 185
• EDTA B13
• Eductors 181
• Electrochemical joining 24
• Electrochemical oxidation B13
• Electrodeposition 14,24,51,64, 87,
• 118,141,144,147,
• 164,174,185
• Electroless copper deposition 43
• Electroless nickel deposition 33,38,43
• Electroless palladium deposition 114
• Electroplating 8,18,59,83,105,133,
• 150,B21
• Electrowinning B7
• Elongation 24
• Emissions B21
• Environmental protection B21
• Etch resists B7
• Filtration B7
• Freundlich isotherm 38
• FTIR 38
• Gelatin 164
• Glycol ethers 71
• Hallmarking B30
• Hard anodizing 181

• Hardness 83
• HDPB 87
• Heat treatment 169
• Heavy metals 29
• Heavy nickel deposition 24
• Historical reviews 8
• Ice skate blades 18
• Impedance spectroscopy 185
• Imperfect mixing 75
• Inhibition 157
• Intermetallics 169
• Internal stress 83
• Ion-exchange membranes B7
• Iron–tin alloys 169
• Isothermal annealing 147
• Joining 24
• Kinetics 59,150
• Laminar composites 129
• Lead 87
• Liquid–solid roll bonding 129
• Lithium chloride 14
• Magnetron sputtering 123
• Mechanical properties 123,141
• Metal dispersion coatings 43
• Metal–polymer composites 43
• Methanesulphonic acid 150
• Microcrystalline layers 144
• Microstructure 64
• Modelling 75,133
• Morphology 51
• Multilayer coatings 51,174
• Nanocomposite coatings 123,141
• Nanocrystalline nickel 141
• Nickel 24,141,174
• Nickel–chromium coatings 18
• Nickel–phosphorus films 144,147
• Nickel–zinc alloys 64,93
• Nickel citrate 33,38
• Nickel losses B21
• Organic contaminants B13
• Organoalkaline electrolytes 118
• Oxide films 157
• PCB fabrication B7,B13
• Phosphating 137
• Polyethylene glycol 114
• Polymer substrates 43
• Pre-rinsing 75
• Pretreatments 24
• Pulsed current 141,144,147
• Raman spectroscopy 118
• Recycling 33
• Regeneration 33,B7
• Relaxation 147
• Roll bonding 129
• Selective dissolution 93
• Sensitisation 114
• Silicon carbide 185
• Simulation 133
• Sodium dodecyl sulphate 87
• Spray rinsing 75
• Stainless steel 24,129
• Steel rebars 137
• Structural relaxation 147
• Sulpho-chromispel-I electrolyte 59,83
• Superhard coatings 123
• Surface analysis 105
• Surface chemistry 105
• Surface morphology 83
• Sustainable technologies B7
• Tensile strength 24
• Texture 64
• Thiamine hydrochloride 164
• Throwing power 59,87
• Tin stripping solutions B7
• Tin 150
• Tinplate 169
• Titanium 24
• Titanium nitride 123
• Tungsten carbide 185
• Ultrasonic cleaning 71
• Wastewater recycling B13
• Wastewater treatment 29
• X-ray diffraction 64
• Zinc 98,164
• Zinc alloy coatings 174
• Zinc–cobalt coatings 51,174
• Zinc–nickel coatings 93,174